Sigray Hosts Apex Hybrid Webinar: Revolutionizing Failure Analysis: Submicron 3D X-ray Imaging Meets Advanced Laminography on May 22nd

Join Us for an Exclusive Webinar on Next-Gen Semiconductor Failure Analysis!

We’re excited to host a webinar on Zoom introducing the Apex Hybrid, a cutting-edge system that redefines non-destructive 3D imaging for advanced semiconductor packaging. Traditional methods fall short when tackling today’s complex devices—chiplets, CoWoS, 300 mm wafers, and dense PCBs. The Apex Hybrid combines high-resolution X-ray microscopy with Precision Angle Laminography (PAL) to deliver sub-micron clarity at unprecedented speed.

📅Don’t miss this opportunity to see real-world case studies showcasing seamless, high-throughput imaging of microbumps, hybrid bonds, TSVs, and more—all without destructive cross-sectioning. Register below!

Morning Session (8 am pst, 11 am est): https://us02web.zoom.us/webinar/register/8017470841615/WN_AC9sUUJfSzqg-jYsi5YxRg
Evening session (8pm pst, 11 pm est, 11 am gmt+8): https://us02web.zoom.us/webinar/register/1317470937383/WN_HtKcimcdRvyRLFuTmKxjxw